Enterprise Technology Budget and Finance Team - Bond Funding

Budget and Finance: Bond Funding

Bond funding is used for capital projects related to digital infrastructure improvements. Our current bond totals $36.46M and covers four main areas: Network Infrastructure and Capacity (NIAC), Research and High Performance Computing (RAHPC), and Facilities, Building Automation, Energy Management and Telemetry, (FBAEMAT), and Asbestos Abatement. Each of these four areas then has subcategories:

NIAC

Student Centered Buildings
Core Infrastructure Security
Research Buildings
Dark Fiber

RAHPC

High Performance Computing
ISTB1 Data Center
High Performance Wireless Access Across Campuses

FBAEMAT

Telemetry Network
Telecommunications, Data Center, and Infrastructure
Building Automation
Data Center Power Systems

Asbestos Abatement

Data Center Power Systems
Core Infrastructure Security
Research Building Switch Routers for Spine Leaf
Research Building Network Hardware Upgrades

Transaction questions can be answered by Taylor Murphy in the Budget and Finance team. Questions regarding overall bond planning should be directed to Justin Alonzo.

Enterprise Technology Budget and Finance